Polyamide moulding composition and use thereof

ABSTRACT

A thermoplastic molding composition, in particular a polyamide molding composition, consisting of, by weight:
         (A) 20-88%—thermoplastic material;   (B) 10-60%—fibrous fillers, formed from
           (B1) 10-60%—glass fibers, selected from:
               glass fibers (B1_1) with a non-circular cross section, wherein the axis ratio of the main cross-sectional axis to the secondary cross-sectional axis is at least 2;   high-strength glass fibers (B1_2) with a glass composition (substantially SiO2, AlO, and MgO; or mixtures thereof;   
               (B2) 0-20%—glass fibers, different from glass fibers of component (B1) and have a circular cross section; and   (B3) 0-20%—further fibrous fillers, different from fibers of (B1) and (B2), not based on glass, and selected from the group: carbon fibers, graphite fibers, aramid fibers, nanotubes;   
           (C) 2-10%—LDS additive or a mixture of LDS additives;   (D) 0-30%—particulate filler;   (E) 0-2%—further, different additives;   the sum of (A)-(E) is 100% by weight.

TECHNICAL FIELD

The present invention relates to polyamide moulding composition havingimproved mechanical properties. The moulding composition contain glassfibres and also particulate fillers. Moulded parts produced therefromcan be metallised selectively after partial irradiation. The mouldingcomposition according to the invention are used in particular for theproduction of moulded interconnected devices.

PRIOR ART

Compared to previous interconnected devices, moulded interconnecteddevices (MIDs)—thermoplastic interconnected devices produced by means ofinjection moulding—have the advantage of improved freedom of design,good environmental compatibility and the potential for rationalisationwith regard to the production method of the end product. The integrationof electrical and mechanical functions in an injection-moulded part canlead to miniaturisation of the assembly. In addition, completely newfunctions can be provided and practically any shapes can be formed.Two-component injection moulding, hot embossing and laser subtractivestructuring are MID manufacturing techniques already used for some yearsin series production.

The additive laser structuring technique, with which the moulded partproduced in the standard injection moulding process is structured bymeans of a laser, is likewise known from EP-A-1 274 288. By means ofthis method, the regions that will later carry the conducting tracks arepartially nucleated with metal atoms on the plastic surface, on which ametal layer then grows in chemically reductive metallisation baths. Themetal nuclei are produced by breaking open metal compounds contained inthe carrier material in a dispersed manner. Particularly well-suitedmetal compounds for laser direct structuring are cupriferous metaloxides with spinel structure. Plastic regions not irradiated remainunchanged in the metallisation bath. In some examples in EP-A-1 274 288,the moulding compound formed from 70% by weight of polybutyleneterephthalate, 30% by weight of silicic acid and 5% by weight of acopper/chromium spinel is processed to form a casing for a mobiletelephone, which is irradiated by an Nd—YAG laser and is then metallisedin the reductive copper-plating bath.

A method for producing interconnected devices made of plastic isdescribed in EP-A-2 420 593, in which metal oxides with an oxygenvacancy are used as LDS (laser direct structuring) additives. A seriesof a wide range of polymers are specified as a suitable matrix, althoughno specific polymer or polymer class is preferred. Unreinforced mouldingcompounds based on polypropylene and polycarbonate are used in theexamples.

EP-A-2 335 936 indicates problems with primary, currentlessmetallisation. For polycarbonate-based moulding compounds, thehomogeneity of the conductor tracks deposited currentlessly after laserstructuring is considerably improved by use of an acid, such asphosphoric acid, or an acid salt.

A possibility for improving the toughness, in particular the notchtoughness, of moulding compounds suitable for LDS is disclosed in EP-A-2390 282. The toughness of moulding compounds based on aromaticpolycarbonates is considerably improved by small amounts of sulphonatesalts, such as potassium perfluorobutane sulphonate.

WO-A-2009/141799 describes flame-retardant, laser-structurable mouldingcompounds based on polycarbonate and polycarbonate/ABS blends. In theexamples, unreinforced moulding compounds containing a copper/chromiumspinel as LDS additive are used exclusively.

DISCLOSURE OF THE INVENTION

Based on the above, the object of the present invention was to providethermoplastic composition (compound) suitable for MID technology, inparticular polyamide moulding composition, and in particular those thatalso contain particulate fillers in addition to glass fibres, with whichmoulded articles having good mechanical properties, in particular havinghigh rigidity, high tear strength and good impact toughness, can beproduced and which do not have the disadvantages of the prior art.

The thermal and mechanical properties and also the associated fields ofuse of these interconnected devices are determined primarily by theunderlying thermoplastic moulding composition. Polyamides are nowadayswidespread as structural elements for interior areas and exterior areas,which can be attributed substantially to the outstanding mechanicalproperties.

An improvement of the mechanical properties, such as strength andrigidity, can be achieved in particular by the addition of fibrousreinforcement substances, such as glass fibres or carbon fibres. In manycases, particulate fillers are also used in addition to the glassfibres, whether in order to colour the moulding compositions by means ofinorganic pigments or to implement specific property modifications.

The moulding composition that can be structured by means of laser directstructuring may contain what are known as laser additives, which releasemetals under the action of electromagnetic radiation. Metal oxides, inparticular spinels, are often used for this laser-induced nucleation. Inorder to increase the microroughness and therefore the adhesion of theconductor track applied later, such moulding composition mayadditionally contain considerable amounts of further fillers, such astalc. Due to the addition of particulate fillers to theglass-fibre-reinforced moulding composition, the mechanical propertiesare generally considerably worsened however, and in particular the tearstrength, the elongation at tear and also the impact toughness isreduced. Consequently, no content or only a small content of particulatefillers can be used in conjunction with standard glass fibres if therigidity, the tear strength and also the impact toughness are consideredas critical parameters for the moulded part.

On the one hand, the addition of the particulate fillers necessary forMID moulding compositions to glass-fibre-reinforced mouldingcompositions results in increased suitability for laser structuring andconductor track adhesion, but on the other hand leads to a deteriorationof the mechanical properties, such as tear strength and toughness. Thepresent invention is based on these conflicting problems.

Specifically, the invention comprises a moulding composition having highrigidity, tear strength and high impact toughness according to Claim 1,in particular consisting of:

-   (A) 20-88% by weight of a thermoplastic material. Here, this    thermoplastic component (A) is preferably formed from polyamide (A1)    with the proviso that up to 40%, preferably up to 20%, up to 10%, or    up to 5% (based here in each case on the proportion by weight of the    overall component (A) in the moulding composition) of the polyamide    (A1) can be replaced by a thermoplastic (A2) not based on polyamide;-   (B) 10-70% by weight of fibrous fillers (component (B)), formed from    -   (B1) 10-70% by weight of glass fibres, selected from the group        consisting of: glass fibres with a non-circular cross section        (B1_(—)1), wherein the axis ratio of the main cross-sectional        axis to the secondary cross-sectional axis is at least 2;        -   high-strength glass fibres (B1_(—)2) with a glass            composition, which are formed substantially from the            components silicon dioxide, aluminium oxide and magnesium            oxide, which preferably have a content of magnesium oxide of            at least 5% by weight and a content of calcium oxide of at            most 10% by weight, particularly preferably of at most 5% by            weight; or mixtures of such glass fibres of type B1_(—)1 and            B1_(—)2;    -   (B2) 0-20% by weight of other glass fibres, which are different        from the glass fibres of component (B1) and have a circular        cross section;    -   (B3) 0-20% by weight of further fibrous fillers, which are        different from the fibres of components (B1) and (B2), are not        based on glass, and are selected from the group: carbon fibres,        graphite fibres, aramid fibres, nanotubes;-   (C) 2-10% by weight of LDS additive or a mixture of LDS additives;-   (D) 0-30% by weight of particulate filler;-   (E) 0-2% by weight of further, different additives;    wherein the sum of (A)-(E) makes up 100% by weight.

The glass fibres of types (B1_(—)1) and (B1_(—)2) may also in each casebe mixtures with different fibres, which all have the features accordingto the claims however, and may equally be a mixture of the fibres(B1_(—)1) and (B1_(—)2).

The fibres of type (B1_(—)2) preferably have a circular cross section.

Here, the component (A) is preferably a thermoplastic selected from thefollowing group: polyamide, polycarbonate, polystyrene, polymethylmethacrylate, acrylonitrile butadiene styrene copolymer, acrylonitrilestyrene copolymer, polyolefin, polyoxymethylene, polyester, inparticular polyethylene terephthalate, polybutylene terephthalate,polysulfone (in particular of the PSU, PESU, PPSU type), polyphenyleneether, polyphenylene sulphide, polyphenylene oxide, liquid-crystallinepolymers, polyether ketone, polyether ether ketone, polyimide, polyamideimide, polyester imide, polyether amide, polyester amide, polyetherester amide, polyurethane (in particular of the TPU, PUR type),polysiloxane, polyacrylate, polymethacrylate and mixtures or copolymersbased on such systems. Here, such systems can also preferably be used incombination with the impact toughness modifiers specified below anddiscussed under (A2).

Here, the component (A) preferably consists completely of polyamide or amixture of various polyamides.

Here, the proportion of component (A) preferably lies in the range of25-82% by weight, preferably in the range of 30-77% by weight, whereinthe total proportion of (A) preferably also lies in the range of 25-82%by weight, particularly preferably in the range of 30-77% by weight.

The proportion of component (B1) preferably lies in the range of 30-65%by weight, preferably in the range of 35-60% by weight, wherein theproportions of (B2) and/or (B3) furthermore are preferably zero.

As explained, the component (A) consists primarily, that is to saypreferably in a proportion of more than 60% based on the plastic matrix,of polyamide. In other words, the ratio of (A1) to (A2) is preferably inany case >1.5, preferably >2, particularly preferably >5.

The other thermoplastic material (component A2), which may likewise beprovided in the form of a mixture with the polyamide constituent (A1),is preferably selected from the group consisting of: polycarbonate,polystyrene, polymethyl methacrylate, acrylonitrile butadiene styrenecopolymer, acrylonitrile styrene copolymer, polyolefin,polyoxymethylene, polyester, in particular polyethylene terephthalate,polybutylene terephthalate, polysulfone (in particular of the PSU, PESU,PPSU type), polyphenylene ether, polyphenylene sulphide, polyphenyleneoxide, liquid-crystalline polymers, polyether ketone, polyether etherketone, polyimide, polyamide imide, polyester imide, polyether amide,polyester amide, polyether ester amide, polyurethane (in particular ofthe TPU, PUR type), polysiloxane, polyacrylate, polymethacrylate, andmixtures or copolymers based on such systems.

The proportion of this further matrix component (A2) preferably lies inthe range of 0-20% by weight, preferably in the range of 0-10% by weightor in the range of 0-5% by weight. However, there is preferably nofurther matrix component (A2), that is to say component (A1) ispreferably exclusively present in the moulding composition.

In a further embodiment, the moulding composition according to theinvention contains up to 40% by weight of one or more impact toughnessmodifiers (ITMs) as component (A2). An ITM concentration in the rangebetween 5 and 40% by weight, in particular of 7-30% by weight, ispreferred. The impact toughness modifier may be a natural rubber,polybutadiene, polyisoprene, polyisobutylene, a mixed polymer ofbutadiene and/or isoprene with styrene or styrene derivatives and othercomonomers, a hydrogenated mixed polymer and/or a mixed polymer that isproduced by grafting or copolymerisation with acid anhydrides,(meth)acrylic acid and esters thereof. The impact toughness modifier(A2) may also be a grafted rubber with a cross-linked elastomer core,which consists of butadiene, isoprene or alkyl acrylates and has a graftsleeve formed from polystyrene, a nonpolar or polar olefin homopolymerand copolymer, such as ethylene propylene rubber, ethylene propylenediene rubber and ethylene octene rubber or ethylene vinyl acetaterubber, or a nonpolar or polar olefin homopolymer and copolymer, whichis produced by grafting or copolymerisation with acid anhydrides,(meth)acrylic acid and esters thereof. The impact toughness modifier(A2) may also be a carboxylic-acid-functionalised copolymer, such aspoly(ethene-co-(meth)acrylic acid) orpoly(ethene-co-1-olefin-co-(meth)acrylic acid), wherein the 1-olefin maybe an alkene or an unsaturated (meth)acrylic acid ester with more than 4atoms, including those copolymers in which the acid groups areneutralised in part with metal ions.

Preferred impact toughness modifiers of component (A2) based on styrenemonomers (styrene and styrene derivatives) and other vinyl aromaticmonomers are block copolymers formed from alkenyl aromatic compounds anda conjugated diene, and hydrogenated block copolymers formed from analkenyl aromatic compound and conjugated dienes, or combinations ofthese ITM types. The block copolymer contains at least one block derivedfrom an alkenyl aromatic compound (A) and at least one block derivedfrom a conjugated diene (B). In the hydrogenated block copolymers, theproportion of aliphatically unsaturated carbon-carbon double bonds hasbeen reduced by hydrogenation. Two-block, three-block, four-block andpolyblock copolymers with linear structure are suitable as blockcopolymers. However, branched and star-shaped structures can also beused. Branched block copolymers are obtained in a known manner, forexample by grafting reactions of polymer “side branches” onto a polymermain chain. Vinyl aromatic monomers that are substituted at the aromaticring and/at the C═C double bond with C1-20 hydrocarbon groups or halogenatoms can also be used as alkenyl aromatic monomers, either in additionto or mixed with styrene.

Examples for alkenyl aromatic monomers are styrene, p-methylstyrene,α-methylstyrene, ethylstyrene, tert-butylstyrene, vinyl toluene,1,2-diphenylethylene, 1,1-diphenylethylene, vinyl xylenes, vinyltoluenes vinyl naphthalenes, divinyl benzenes, bromostyrenes,chlorostyrenes, and combinations thereof. Styrene, p-methylstyrene,alpha-methylstyrene and vinyl naphthalene are preferred.

Styrene, α-methylstyrene, p-methylstyrene, ethylstyrene, tert-butylstyrene, vinyl toluene, 1,2-diphenylethylene, 1,1-diphenylethylene ormixtures thereof are preferably used. Styrene is particularly preferablyused. Alkenyl naphthalenes may also be used however. For example,1,3-butadiene, 2-methyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene,1,3-pentadiene, 1,3-hexadiene, isoprene, chloroprene and piperylene arepossible diene monomers. 1,3-butadiene and isoprene are preferred, inparticular 1,3-butadiene (referred to hereinafter as butadiene forshort).

Styrene is preferably used as an alkenyl aromatic monomer, and butadieneis preferably used as a diene monomer, that is to say the styrenebutadiene block copolymer is preferred. The block copolymers aregenerally produced by anionic polymerisation in a manner known per se.

In addition, further comonomers can also be used additionally with thestyrene and diene monomers. The proportion of comonomers is preferably 0to 50, particularly preferably 0 to 30, and in particular 0 to 15% byweight, based on the total amount of the monomers used. Suitablecomonomers include, for example, acrylates, in particular C1-12-alkylacrylates such as n-butyl acrylate or 2-ethylhexyl acrylate, and thecorresponding methacrylates, in particular C1-12-alkyl methacrylates,such as methyl methacrylate (MMA). Further possible comonomers are(meth)acrylonitrile, glycidyl(meth)acrylate, vinyl methyl ether, diallylether and divinylether of bifunctional alcohols, divinylbenzene andvinyl acetate.

In addition to the conjugated diene, the hydrogenated block copolymersof component (A2) optionally also contain proportions of lowhydrocarbons, such as ethylene, propylene, 1-butene, dicyclopentadieneor unconjugated dienes. The proportion of unreduced aliphaticunsaturated bonds, which result from the block B, in the hydrogenatedblock copolymers is less than 50%, preferably less than 25%, inparticular less than 10%. The aromatic proportions from block A arereduced at most to 25%. The hydrogenated block copolymersstyrene-(ethylene-butylene) two-block copolymers andstyrene-(ethylene-butylene)-styrene three-block copolymers are obtainedby hydrogenation of styrene-butadiene copolymers andstyrene-butadiene-styrene copolymers. The block copolymers preferablyconsist in an amount of 20 to 90% by weight of block A, in particular inan amount of 50 to 85% by weight of block A. The diene can beincorporated into the block B in 1,2 orientation or in 1,4 orientation.

The molar mass of the block copolymers of component (A2) is preferably5,000 to 500,000 g/mol, preferably 20,000 to 300,000 g/mol, inparticular 40,000 to 200,000 g/mol. Suitable hydrogenated blockcopolymers are the commercially obtainable products, such as KRATON®(Kraton Polymers) G1650, G1651, and G1652 and also TUFTEC® (AsahiChemical) H1041, H1043, H1052, H1062, H1141 and H1272.

Examples of non-hydrogenated block copolymers arepolystyrene-polybutadiene, polystyrene-poly(ethylene-propylene),polystyrene-polyisoprene, poly(α-methyl-styrene)-polybutadiene,polystyrene-polybutadiene-polystyrene (SBS),polystyrene-poly(ethylene-propylene)-polystyrene,polystyrene-polyisoprene-polystyrene andpoly(α-methylstyrene-polybutadiene-poly(α-methylstyrene), andcombinations thereof.

Suitable non-hydrogenated block copolymers, which are commerciallyobtainable, are various products having the brand names SOLPRENE®(Phillips), KRATON® (Shell), VECTOR® (Dexco) and SEPTON® (Kuraray).

In accordance with a further preferred embodiment, the mouldingcompositions according to the invention are characterised in that thecomponent (A2) contains a polyolefin homopolymer or anethylene-α-olefin-copolymer, particularly preferably an EP and/or EPDMelastomer (ethylene propylene rubber or ethylene propylene dienerubber). For example, this may be an elastomer based on anethylene-C3-12-α-olefin copolymer with 20 to 96, preferably 25 to 85% byweight of ethylene, wherein the C3-12-α-olefin is particularlypreferably an olefin selected from the group propene, 1-butene,1-pentene, 1-hexene, 1-octene, 1-decene and/or 1-dodecene, and thecomponent C is particularly preferably ethylene propylene rubber and/orLLDPE and/or VLDPE.

Alternatively or additionally (for example in mixture), (A2) may containa terpolymer based on ethylene-C3-12-α-olefin with an unconjugateddiene, wherein this preferably contains 25 to 85% by weight of ethyleneand at most approximately 10% by weight of an unconjugated diene,wherein the C3-12-α-olefin is particularly preferably an olefin selectedfrom the group propene, 1-butene, 1-pentene, 1-hexene, 1-octene,1-decene and/or 1-dodecene, and/or wherein the unconjugated diene ispreferably selected from the group bicyclo(2.2.1) heptadiene,hexadiene-1.4, dicyclopentadiene and/or in particular 5-ethylidenenorbornene.

In addition, ethylene acrylate copolymers are a possible constituent forthe component (A2). Further possible forms of constituents for thecomponent (A2) are ethylene butylene copolymers or mixtures (blends)containing systems of this type.

The component (A2) preferably has constituents comprising acid anhydridegroups, which are introduced by thermal or radical reaction of theprimary chain polymer with an unsaturated dicarboxylic acid anhydride,an unsaturated dicarboxylic acid or an unsaturated dicarboxylic acidmono alkyl ester in a concentration sufficient for good bonding to thepolyamide, wherein, for this purpose, reagents selected from thefollowing group are preferably used: maleic acid, maleic acid anhydride,maleic acid mono butyl ester, fumaric acid, aconitic acid and/oritaconic acid anhydride.

0.1 to 4.0% by weight of an unsaturated anhydride are preferably graftedonto the impact toughness component as a constituent of (A2), or theunsaturated dicarboxylic acid anhydride or the precursor thereof isgrafted on together with a further unsaturated monomer. The graftingdegree is generally preferably in a range of 0.1-1.0%, particularlypreferably in a range of 0.3-0.7%. A mixture of an ethylene propylenecopolymer and an ethylene butylene copolymer, with a maleic acidanhydride grafting degree (MAH grafting degree) in the range of0.3-0.7%, is also a possible constituent of component (A2). Theabove-specified possible systems for the component may also be used inmixtures. Furthermore, the component (A2) may have constituents thathave functional groups, such as carboxylic acid groups, ester groups,epoxy groups, oxazoline groups, carbodiimide groups, isocyanate groups,silanol groups and carboxylate groups, or contain combinations of two ormore of the aforementioned functional groups. Monomers that carry thesefunctional groups can be bonded to the elastomeric polyolefin bycopolymerisation or grafting. In addition, the ITM based on olefinpolymers can also be modified by grafting with an unsaturated silanecompound, such as vinyltrimethoxysilane, vinyltriethoxysilane,vinyltriacetosilane, methacryloxypropyltrimethoxysilane orpropenyltrimethoxysilane.

The elastomeric polyolefins are statistical, alternating or segmentedcopolymers with linear, branched or core-shell structure and containfunctional groups, which can react with the end groups of the polyamidessuch that a sufficient level of compatibility results between thepolyamide and the ITM.

The ITMs used as component (A2) therefore include homopolymers orcopolymers of olefins, such as ethylene, propylene, butene-1, orcopolymers of olefins and copolymerisable monomers, such as vinylacetate, (meth)acrylic acid ester and methylhexadiene.

Examples of crystalline olefin polymers are low-density, medium-densityand high-density polyethylenes, polypropylene, polybutadiene,poly-4-methylpentene, ethylene propylene block copolymers or statisticalcopolymers, ethylene methylhexadiene copolymers, propylenemethylhexadiene copolymers, ethylene propylene butene copolymers,ethylene propylene hexene copolymers, ethylene propylene methylhexadienecopolymers, poly(ethylene vinyl acetate) (EVA), poly(ethylene ethylacrylate) (EEA), ethylene octene copolymer, ethylene butane copolymer,ethylene hexene copolymer, ethylene propylene diene terpolymers, andcombinations of the aforementioned polymers.

Examples of commercially obtainable impact toughness modifiers, whichcan be used within the scope of the constituents of component (A2), are:TAFMER MC201: g-MAH (−0.6%) blend of 67% EP copolymer (20 mol %propylene)+33% EB copolymer (15 mol % butene-1)); TAFMER MH5010: g-MAH(−0.6%) ethylene butylene copolymer; TAFMER MH7010: g-MAH (−0.7%)ethylene butylene copolymer; Mitsui. TAFMER MH7020: g-MAH (−0.7%) EPcopolymer by Mitsui Chemicals; EXXELOR VA1801: g-MAH (−0.7%) EPcopolymer; EXXELOR VA1803: g-MAH (0.5-0.9%) EP copolymer, amorph;EXXELOR VA1810: g-MAH (−0.5%) EP copolymer; EXXELOR MDEX 94-1 1: g-MAH(0.7%) EPDM, Exxon Mobile Chemical; FUSABOND MN493D: g-MAH (−0.5%)ethylene octane copolymer; FUSABOND A EB560D (g-MAH) ethylene n-butylacrylate copolymer; ELVALOY, DuPont.

An ionomer within the scope of component (A2) is also preferred, inwhich the polymer-bonded carboxyl groups are interconnected completelyor partially by metal ions. Mixed polymers of butadiene with styrenefunctionalised by grafting with maleic acid anhydride, nonpolar or polarolefin homopolymers and copolymers, which are produced by grafting withmaleic acid anhydride, and carboxylic-acid-functionalised copolymerssuch as poly(ethene-co-(meth)acrylic acid) orpoly(ethene-co-1-olefin-co-(meth)acrylic acid), in which the acid groupsare neutralised in part with metal ions, are particularly preferred.

The moulding composition preferably consists of 20 to 80% by weight ofpolyamide (A1), which can be formed from aliphatic, cycloaliphatic oraromatic monomers. In particular, the moulding compositions according tothe invention contain semi-crystalline, aliphatic polyamides,semi-crystalline or amorphous, semi-aromatic polyamides, andsemi-crystalline or amorphous polyamides, for example based oncycloaliphatic diamines.

The matrix of the polyamide moulding compositions used in accordancewith the invention is further based, as has been described above,preferably on at least one semi-crystalline, aliphatic polyamide(component A1_(—)1) and/or semi-aromatic polyamide (component A1_(—)2),and/or on at least one amorphous polyamide (component A1_(—)3) based oncycloaliphatic diamines, or on a mixture of components A1_(—)1 andA1_(—)2, A1_(—)1 and A1_(—)3 or a mixture of type A1_(—)1, A1_(—)2 andA1_(—)3.

The aforementioned polyamides can be produced from the followingdicarboxylic acids: adipic acid, suberic acid, azelaic acid, sebacicacid, undecane diacid, dodecane diacid, tridecane diacid, tetradecanediacid, pentadecane diacid, hexadecane diacid, heptadecane diacid,octadecane diacid, C36-dimer fatty acid, isophthalic acid, terephthalicacid, naphthalene dicarboxylic acid, cis- and/ortrans-cyclohexane-1,4-dicarboxylic acid and/or cis- and/ortrans-cyolohexane-1,3-dicarboxylic acid (CHDA) and mixtures thereof.

The following monomers can be considered as diamines: 1,4-butanediamine,1,5-pentanediamine, 2-methyl-1,5-pentanediamine,2-butyl-2-ethyl-1,5-pentanediamine, 1,6-hexanediamine,2,2,4-trimethylhexamethylenediamine,2,4,4-trimethylhexamethylenediamine, 1,8-octanediamine,2-methyl-1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine,1,11-undecanediamine, 1,12-dodecanediamine, 1,13-tridecanediamine,1,14-tetradecanediamine, m-xylylenediamine and p-xylylenediamine.Furthermore, the polyamides can also be based on lactams or aminocarboxylic acids, in particular α,ω-amino acids or lactams comprising 6to 12 carbon atoms, wherein the following selection is mentioned by wayof example: m-aminobenzoic acid, p-aminobenzoic acid, caprolactam (CL),ω-aminocaproic acid, ω-aminoheptanoic acid, ω-aminoctanoic acid,ω-aminononanoic acid, ω-aminodecanoic acid, ω-aminoundecanoic acid(AUA), laurolactam (LL) and α,ω-aminododecanoic acid (ADA). Caprolactam,aminocaproic acid, laurolactam, and aminododecanoic acid areparticularly preferred. Suitable cycloaliphatic diamines are thosecomprising 6 to 24 carbon atoms, such asbis-(4-amino-3-methyl-cyclohexyl)-methane (MACM),bis-(4-amino-cyclohexyl)-methane (PACM),bis-(4-amino-3-ethyl-cyclohexyl)-methane (EACM),bis-(4-amino-3,5-dimethyl-cyclohexyl)-methane (TMACM), 2,6-norbornanediamine or 2,6-bis-(aminomethyl)-norbornane or 1,3-cyclohexyldiamine,1,4-cyclohexyldiamine, bis-(1,3-aminomethyl)cyclohexane, isophoronediamine, cyclohexane diamine, 1,3-bis-(aminomethyl)cyclohexane,1,4-bis-(aminomethyl)cyclohexane, isophorone diamine, norbornanedimethylamine, 2,2-(4,4′-diaminodicyclohexyl)propane (PACP), or mixturesthereof. In particular, alkyl-substituted bis-(aminocyclohexyl)methaneor bis-(aminocyclohexyl)propane is preferred. Linear and/or branchedC1-C6, preferably C1-C4 alkyl groups are preferred as alkylsubstituents, therefore in particular methyl groups, ethyl groups,propyl groups, isopropyl or butyl groups, with methyl groups beingpreferred in particular. Bis-(4-amino-3-methyl-cyclohexyl)-methane(MACM) is used as alkyl-substituted bis-(aminocyclohexyl)methane in aparticularly preferred embodiment.

The polyamides A1_(—)1 or A1_(—)2 or A1_(—)3 preferably have a solutionviscosity η_(rel), measured in m-cresol (0.5% by weight, 20° C.) in therange from 1.4 to 3.0, preferably in the range from 1.5 to 2.7, inparticular in the range from 1.5 to 2.4.

Polyamide 46, polyamide 6, polyamide 66, polyamide 11, polyamide 12,polyamide 1212, polyamide 1010, polyamide 1012, polyamide 1112,polyamide 610, polyamide 612, polyamide 69, polyamide 810, or mixtures,blends, or alloys thereof are preferred as aliphatic polyamides.

Preferred amorphous or semi-crystalline polyamides based oncycloaliphatic diamines are MACM9, MACM10, MACM11, MACM12, MACM13,MACM14, MACM16, MACM18, PACM9, PACM10, PACM11, PACM12, PACM13, PACM14,PACM16, PACM18 or copolyamides, such as MACMI/12, MACMT/12,6I/6T/MACMI/MACMT/12, 3-6T, 6I/MACMI/MACMT, 6I/PACMI/PACMT, 6I/6T/MACMI,MACMI/MACM36, 12/PACMI or 12/MACMT, 6/PACMT, 6/IPDT, or mixturesthereof, MACM10/PACM10 and MACM12/PACM12, and mixtures thereof.

Semi-aromatic polyamides are preferably based either on aromaticdicarboxylic acids comprising 8 to 18, preferably 8 to 14 carbon atoms,or on diamines having aromatic structural units, such as PXDA and/orMXDA. Preferred aromatic dicarboxylic acids are TPA, naphthalenedicarboxylic acid and IPA. Preferred semi-aromatic polyamides are basedon the following polyamide systems: 4T, 5T, DT, 6T, 9T, MT, 10T, 12T,4I, 5I, DI, 6I, 9I, MI, 10I, 12I. These can be combined with one anotheras homopolyamides and also as binary, ternary or quaternarycopolyamides, provided this is allowed by the processing temperature.Furthermore, aliphatic polyamide systems, such as PA46, PA6, PA66, PA11,PA12, PA1212, PA1010, PA1012, PA610, PA612, PA69, PA81, can also becombined. Preferred semi-aromatic polyamides are: MXD6, MXD10,MXDI/MXD6, 6T/61, 6T/66, 6T/10T, 6T/12, 11/10T, 12/10T, 10T/1010,10I/10T, 10T/1012, 9MT (M stands for 2-methyloctane diamine), 12T.

With regard to the polyamides A2, the copolyamides 6T/6I, 10I/10T,MXD6/MXDI and also the homopolyamides MACM12 and MXD6 are preferred.With regard to the copolyamides 6T/6I, two different composition rangesare particularly preferred. On the one hand, these are the amorphouscopolyamides having a proportion of less than 50 mol % of 6T units,wherein a composition range 6T:6I from 20:80 to 45:55 is preferred, andon the other hand these are the copolyamides having a high melting pointwith a 6T proportion of greater than 50 mol %, wherein a compositionrange 6T:6I from 55:45 to 80:20, in particular from 65:35 to 75:25, ispreferred. With regard to the copolyamides MXD6/MXDI, MXD6-richcompositions are preferred, in particular with an MXD6 content ofgreater than 80 mol %, particularly preferably in the range from 82 to95 mol %. With regard to a polymer mixture containing the polyamidecomponents A1_(—)1 and A1_(—)2, A1_(—)1 and A1_(—)3, A1_(—)2 and A1_(—)3and also A1_(—)1, A1_(—)2 and A1_(—)3, the following compositions arepreferred:

-   (A1_(—)1): PA 66-   (A1_(—)2): PA 6I/6T, wherein the molar ratio is in the range from    65:35 to 75:25, or in particular is 67:33.-   (A1_(—)1): PA 610 and/or PA1010, wherein, in the case of a mixture,    the components are used in a ratio from 1:1 to 4:1.-   (A1_(—)2): PA 6I/6T, wherein the molar ratio lies in the range from    65:35 to 75:25, or in particular is 67:33.-   (A1_(—)1): mixture of PA 6 and PA66, in a ratio from 1:2 to 1:4, in    particular of 1:4-   (A1_(—)2): PA 6I/6T, wherein the molar ratio lies in the range from    65:35 to 75:25, or in particular is 67:33.-   (A1_(—)1): PA 66-   (A1_(—)2): PA 6T/6I, wherein the molar ratio lies in the range from    60:40 to 75:25 or in particular is 70:30.-   (A1_(—)1): PA 66-   (A1_(—)2): PA 6T/66, wherein the molar ratio lies in the range from    50:50 to 70:30 or in particular is 55:45.-   (A1_(—)1): PA 66-   (A1_(—)2): MXD6, MXD10 or PA MXD6/MXDI, wherein, in the copolyamide,    the molar ratio lies in the range from 70:30 to 90:10, or in    particular is 88:12.-   (A1_(—)1): PA 12-   (A1_(—)3): PA MACM12.-   (A1_(—)1): PA 12-   (A1_(—)3): PA MACMI/12, wherein the content of laurolactam lies in    the range from 15 to 45 mol %, preferably less than 40 mol %, and in    particular lies in the range from 20 to 35 mol %.

Here, the proportion of component (A1_(—)1) preferably lies in each casein the range from 50 to 90% by weight, in particular from 60 to 85% byweight, and the proportion of component (A1_(—)2) and/or (A1_(—)3)preferably lies in the range from 10 to 50% by weight, in particular inthe range from 15 to 40% by weight.

In a specific embodiment, the following compositions are preferred forthe polymer mixture (polyamide matrix):

-   (A1_(—)1): 50-100% by weight PA 1010 or PA 1012 or PA 11 or PA 12-   (A1_(—)3): 0-50% by weight PA MACM12 or PA MACMI/12 or PA    PACM12/MACM12,-   (A1_(—)1): 55-85% by weight PA 610 or PA 612 or PA 1010 or PA 1012    or PA 1210 or PA1212-   (A1_(—)3): 15-45% by weight PA 6T/6I or PA 10T/10I, wherein the 6I    or 10I proportion respectively is 55-80 mol % (preferably 60-75 mol    %).-   (A1_(—)1): 70-100% by weight of a mixture of PA 6 and PA66, in a    ratio from 1:2 to 1:4, in particular of 1:4-   (A1_(—)2): 0-30% by weight PA 6I/6T, wherein the molar ratio lies in    the range from 65:35 to 75:25, or in particular is 67:33.

In a further embodiment, the component A1_(—)2 has a glass transitiontemperature of greater than 90° C., preferably greater than 110° C. andparticularly preferably greater than 140° C. The following embodiment isparticularly preferred:

-   (A1_(—)1): 55-85% by weight PA 610 or PA 612 or PA 1010 or PA 1012    or PA 1210 or PA 1212-   (A1_(—)3): 15-45% by weight PA 6T/6I or PA 10T/10I, wherein the 6I    or 10I proportion respectively is 55-80 mol % (preferably 60-75 mol    %).

Semi-aromatic, semi-crystalline polyamide systems can preferably also beused as component (A1).

Moulding composition that are suitable for reflow soldering, that is tosay that can withstand temporary temperature loads of 260-270° C.without warping and blistering, are preferably involved.

In accordance with a preferred embodiment, the component (A1), whichthen preferably makes up the totality of (A), is formed from PA 10T/6Tcopolyamide, wherein this is formed from:

(AA) 40 to 95 mol %, preferably 60 to 95 mol % of 10T units, formed fromthe monomers 1,10-decanediamine and terephthalic acid;

(BB) 5 to 60 mol %, preferably 5 to 40 mol % of 6T units, formed fromthe monomers 1,6-hexanediamine and terephthalic acid.

Here, up to 30% of the monomers within the component (A1) thus formedcan be replaced, that is to say the above is true on the one hand withthe provision that, in component (A1), up to 30 mol % of theterephthalic acid, based on the total amount of dicarboxylic acids, canbe replaced in (AA) and/or (BB), independently of one another, by otheraromatic, aliphatic or cycloaliphatic dicarboxylic acids comprising 6 to36 carbon atoms. Furthermore, the above is true on the other hand withthe provision that, in component (A1), up to 30 mol % of1,10-decanediamine or 1,6-hexanediamine, based on the total amount ofdiamines, can be replaced in (AA) and/or (BB), independently of oneanother, by other diamines comprising 4 to 36 carbon atoms. Last but notleast, the above is also true with the provision that no more than 30mol % in component (A1), based on the total amount of monomers, can beformed by lactams or amino acids. It is, however, preferable if thisreplacement of the monomers within component (A1) in accordance with theabove provisions accounts for less than 20%, preferably less than 10%,and if in particular there is preferably no replacement of this type. Onthe whole, a further provision is the fact that the sum of the monomersreplacing the terephthalic acid, 1,6-hexanediamine and1,10-decanediamine (that is to say the total proportion of otheraromatic, aliphatic or cycloaliphatic dicarboxylic acids comprising 6 to36 carbon atoms, of other diamines comprising 4 to 36 carbon atoms, andof lactams or amino acids) does not exceed a concentration of 30 mol %,preferably 20 mol %, in particular 10 mol %, based on the total amountof the monomers used in component A.

In accordance with a preferred embodiment, the component (A1), whichthen preferably makes up the totality of (A), is then preferably formedfrom polyamide 10T/10I/6T/6I, specifically a semi-aromatic,semi-crystalline copolyamide formed from 100% by weight of diacidfraction composed of:

72.0-98.3% by weight of terephthalic acid (TPA);

28.0-1% by weight of isophthalic acid (IPA)

and 100% by weight of diamine fraction composed of:

51.0-80.0% by weight of 1,6-hexanediamine (HMDA);

20.0-49.0% by weight of C9-C12 diamine;

wherein the C9-C12 diamine is a diamine selected from the group:1,9-nonanediamine, methyl-1,8-octanediamine, 1,10-decanediamine,1,11-undecanediamine, 1,12-dodecanediamine, or a mixture of diamines ofthis type, wherein 1,10-decanediamine and 1,12-dodecanediamine arepreferred, and 1,10-decanediamine alone is particularly preferred. Apolyamide system PA 10T/10I/6T/6I is thus preferred, wherein the aboveconcentrations apply.

In accordance with a preferred embodiment, the component (A1), whichthen preferably makes up the totality of (A), is formed from polyamidePA 6T/6116, specifically a semi-aromatic, semi-crystalline copolyamideformed from terephthalic acid (TPA), isophthalic acid (IPA),1,6-hexanediamine (HMDA) and caprolactam (CLM) or aminocaproic acid,wherein the copolyamide 6T/6I/6 has the composition 60-80/15-25/5-15% byweight particularly preferably 65-75/17.5-22.5/7.5-12.5% by weight.

To summarise, it can be determined that the component (A1) is preferablya homopolyamide and/or copolyamide formed from aliphatic, cycloaliphaticand/or aromatic monomers, and is preferably a mixture of asemi-crystalline, aliphatic polyamide (A1_(—)1) and/or a semi-aromaticpolyamide (A1_(—)2), and/or an amorphous polyamide (A1_(—)3), whereinthe polyamides of component (A1) are preferably selected from thefollowing group: polyamide 46, polyamide 6, polyamide 66, polyamide 11,polyamide 12, polyamide 1212, polyamide 1010, polyamide 1012, polyamide1112, polyamide 610, polyamide 612, polyamide 69, polyamide 810, MACM9,MACM10, MACM11, MACM12, MACM13, MACM14, MACM16, MACM18, PACM9, PACM10,PACM11, PACM12, PACM13, PACM14, PACM16, PACM18 or copolyamides, such asMACMI/12, MACMT/12, 6I/6T/MACMI/MACMT/12, 3-6T, 6I/MACMI/MACMT,6I/PACMI/PACMT, 6I/6T/MACMI, MACMI/MACM36, 12/PACMI, 12/MACMT, 6/PACMT,6/IPDT, MACM10/PACM10, MACM12/PACM12, MXD6, MXD10, MXDI/MXD6, 6T/6I,6T/66, 6T/10T, 6T/12, 11/10T, 12/10T, 10T/1010, 10I/10T, 10T/1012,PA10T/6T, PA6T/10I/10T, PA6T/6I/6, 9MT (M stands for 2-methyloctanediamine), 12T, and mixtures or blends thereof.

Furthermore, the moulding composition contain 10 to 70% by weight ofglass fibres (B1), selected from the group consisting of

-   -   (B1_(—)1) glass fibres, preferably from E-glass, with a        non-circular cross section (flat fibres) and with an axis ratio        of the main cross-sectional axis to the secondary        cross-sectional axis of at least 2, and/or    -   (B1_(—)2) high-strength glass fibres with a circular or        non-circular cross section and a glass composition based        substantially on the components silicon dioxide, aluminium oxide        and magnesium oxide,        which for example are used in the form of what are known as        short fibres (for example cut glass with a length of 0.2-20 mm)        or endless fibres (rovings).

E-glass fibres in accordance with ASTM D578-00 are preferably selectedas glass fibres (B1_(—)1) with a non-circular cross section, preferablyformed from 52-62% of silicon dioxide, 12-16% of aluminium oxide, 16-25%of calcium oxide, 0-10% of borax, 0-5% of magnesium oxide, 0-2% ofalkali oxides, 0-1.5% of titanium dioxide and 0-0.3% of iron oxide.

The high-strength glass fibre (B1_(—)2) used is based on the ternarysystem silicon dioxide/aluminium oxide/magnesium oxide or on thequaternary system silicon dioxide/aluminium oxide/magnesiumoxide/calcium oxide, wherein the sum of the contents of silicon dioxide,aluminium oxide and magnesium oxide is at least 78% by weight,preferably at least 87% and particularly preferably at least 92%, basedon the total glass composition.

Specifically, a composition of 58-70% by weight of silicon dioxide(SiO₂), 15-30% by weight of aluminium oxide (Al₂O₃), 5-15% by weight ofmagnesium oxide (MgO), 0-10% by weight of calcium oxide (CaO) and 0-2%by weight of further oxides, such as zirconium dioxide (ZrO₂), boronoxide (B₂O₃), titanium dioxide (TiO₂) or lithium oxide (Li₂O), ispreferably used.

In a further embodiment, the high-strength glass fibre has a compositionof 60-67% by weight of silicon dioxide (SiO₂), 20-28% by weight ofaluminium oxide (Al₂O₃), 7-12% by weight of magnesium oxide (MgO), 0-9%by weight of calcium oxide (CaO) and also 0-1.5% by weight of furtheroxides, such as zirconium dioxide (ZrO₂), boron oxide (B₂O₃), titaniumdioxide (TiO₂), or lithium oxide (Li₂O).

The high-strength glass fibre particularly preferably has the followingcomposition: 62-66% by weight of silicon dioxide (SiO₂), 22-27% byweight of aluminium oxide (Al₂O₃), 8-12% by weight of magnesium oxide(MgO), 0-5% by weight of calcium oxide (CaO), and 0-1% by weight offurther oxides, such as zirconium dioxide (ZrO₂), boron oxide (B₂O₃),titanium dioxide (TiO₂), or lithium oxide (Li₂O).

The high-strength glass fibre has a tensile strength of greater than orequal to 3700 MPa, preferably of at least 3,800 or 4,000 MPa, anelongation at tear of at least 4.8%, preferably of at least 4.9 or 5.0%,and a tensile modulus of elasticity of greater than 75 GPa, preferablyof more than 78 or 80 GPa, wherein these glass properties are to bedetermined on individual fibres (pristine single filament) having adiameter of 10 μm and a length of 12.7 mm at a temperature of 23° C. anda relative humidity of 50%.

Specific examples for these high-strength glass fibres of component (B1)are S-glass fibres by Owens Corning with 995 size, T-glass fibres byNittobo, HiPertex by 3B, HS4-glass fibres by Sinoma Jinjing Fiberglass,R-glass fibres by Vetrotex and S-1- and S-2-glass fibres by AGY.

The high-strength glass fibres (B1_(—)2) preferably have a circular ornon-circular cross-sectional area. The glass fibres (B1_(—)1) alwayshave a non-circular cross section, whereas the glass fibres (B2) alwayshave a circular cross section. The fibrous filler (B3) may have acircular or a non-circular cross section.

Glass fibres with a circular cross section, that is to say round glassfibres, typically have a diameter in the range of 5-20 μm, preferably inthe range of 6-17 μm and particularly preferably in the range of 6-13μm. They are preferably used as short glass fibres (cut glass with alength from 0.2 to 20 mm, preferably 2-12 mm).

In the case of the flat glass fibres, that is to say glass fibres with anon-circular cross-sectional area, these glass fibres are preferablyused with a dimensional ratio of the main cross-sectional axis to thesecondary cross-sectional axis arranged perpendicular thereto of morethan 2, preferably from 2 to 8, in particular from 2 to 5. These “flatglass fibres” have an oval or elliptical cross-sectional area, anelliptical cross-sectional area provided with one or more constrictions(what are known as cocoon fibres), a polygonal or rectangularcross-sectional area, or a practically rectangular cross-sectional area.A further characterising feature of the flat glass fibres used lies inthe fact that the length of the main cross-sectional axis preferablylies in the range from 6 to 40 μm, in particular in the range from 15 to30 μm, and the length of the secondary cross-sectional axis preferablylies in the range from 3 to 20 μm, in particular in the range from 4 to10 μm. Here, the flat glass fibres have a maximum packing density, thatis to say the cross-sectional area of the glass fibres fills a virtualrectangle, surrounding the glass fibre cross section as exactly aspossible, to an extent of at least 70%, preferably at least 80% andparticularly preferably to an extent of at least 85%.

To reinforce the moulding compositions according to the invention,mixtures of glass fibres with circular and non-circular cross sectioncan also be used, wherein the proportion of flat glass fibres ispreferably predominant, that is to say makes up more than 50% by weightof the total mass of the fibres.

The glass fibres according to the invention may be provided inparticular with a size suitable for thermoplastics, in particular forpolyamide, containing a coupling agent based on an aminosilane orepoxysilane compound.

The high-strength glass fibres for example used as roving in accordancewith the invention have a diameter from 8 to 20 μm, preferably from 12to 18 μm, wherein the cross section of the glass fibres can be round,oval, elliptical, elliptical provided with one or more constrictions,polygonal, rectangular or practically rectangular. “Flat glass fibres”with a ratio of the cross-sectional axes from 2 to 5 are particularlypreferred. These endless fibres are incorporated into the polyamidemoulding compositions according to the invention by known methods forproduction of long-fibre-reinforced rod granulate, in particular bypultrusion methods, in which the endless fibre strand (roving) is fullysaturated with the polymer melt and is then cooled and cut. Thelong-fibre-reinforced rod granulate obtained in this manner, whichpreferably has a granulate length from 3 to 25 mm, in particular from 4to 12 mm, can be further processed by means of the conventionalprocessing methods (such as injection moulding, pressing) to formmoulded parts.

The fibre concentration (component (B) as a whole), but in particularalso the glass fibre concentration (sum of components (B1) and (B2), andmost preferably the concentration of component (B1) alone in themoulding compositions according to the invention is preferably between30 and 60% by weight and particularly preferably between 35 and 55% byweight.

The flat glass fibres of component (B1_(—)1) are preferably selected inthis case for example as E-glass fibres in accordance with ASTM D578-00with a non-circular cross section, preferably formed from 52-62% ofsilicon dioxide, 12-16% of aluminium oxide, 16-25% of calcium oxide,0-10% of borax, 0-5% of magnesium oxide, 0-2% of alkali oxides, 0-1.5%of titanium dioxide and 0-0.3% of iron oxide.

The glass fibres of component (B1_(—)1), as flat E-glass fibres,preferably have a density of 2.54-2.62 g/cm³, a tensile modulus ofelasticity of 70-75 GPa, a tensile strength of 3,000-3,500 MPa, and anelongation at tear of 4.5-4.8%, wherein the mechanical properties havebeen determined on individual fibres having a diameter of 10 μm and alength of 12.7 mm at 23° C. and a relative humidity of 50%.

The proportion of component (B2), preferably selected from the groupconsisting of round E-glass fibres, A-glass fibres, C-glass fibres,D-glass fibres, basalt fibres and mixtures thereof, in each case with acircular or non-circular cross-sectional area, preferably lies in therange of 0-10% by weight, preferably in the range of 0-5% by weight,wherein component (B1) is particularly preferably provided exclusively.

The component (B2) selected from the group consisting of: E-glass fibres(these consist, in accordance with ASTM D578-00, of 52-62% of silicondioxide, 12-16% of aluminium oxide, 16-25% of calcium oxide, 0-10% ofborax, 0-5% of magnesium oxide, 0-2% of alkali oxides, 0-1.5% oftitanium dioxide and 0-0.3% of iron oxide; preferably have a density of2.58±0.04 g/cm3, a tensile modulus of elasticity of 70-75 Gpa, a tensilestrength of 3,000-3,500 MPa and an elongation at tear of 4.5-4.8%),A-glass fibres (63-72% of silicon dioxide, 6-10% of calcium oxide,14-16% of sodium oxide and potassium oxide, 0-6% of aluminium oxide,0-6% of boron oxide, 0-4% of magnesium oxide), C-glass fibres (64-68% ofsilicon dioxide, 11-15% of calcium oxide, 7-10% of sodium oxide andpotassium oxide, 3-5% of aluminium oxide, 4-6% of boron oxide, 2-4% ofmagnesium oxide), D-glass fibres (72-75% of silicon dioxide, 0-1% ofcalcium oxide, 0-4% of sodium oxide and potassium oxide, 0-1% ofaluminium oxide, 21-24% of boron oxide), basalt fibres (mineral fibrewith approximate composition: 52% of SiO₂, 17% of A1₂O₃, 9% of CaO, 5%of MgO, 5% of Na₂O, 5% of iron oxide and further metal oxides), AR-glassfibres (55-75% of silicon dioxide, 1-10% of calcium oxide, 11-21% ofsodium and potassium oxide, 0-5% of aluminium oxide, 0-8% of boronoxide, 0-12% of titanium dioxide, 1-18% of zirconium oxide, 0-5% of ironoxide), and mixtures thereof.

Component B2 is particularly preferably formed from glass fibres formedsubstantially from the components silicon dioxide, calcium oxide andaluminium oxide, and the ratio by weight of SiO₂/(CaO+MgO) is less than2.7, preferably less than 2.5 and in particular between 2.1 and 2.4.Component B2 is particularly an E-glass fibre according to ASTM D578-00.

The fibrous fillers of component (B1) and/or (B2) and/or (B3) can bepresent in the form of short fibres, preferably in the form of cutfibres having a length in the range of 0.2-20 mm, or in the form ofendless fibres.

The proportion of component (C) preferably lies in the range of 3-8% byweight, preferably in the range of 3-6% by weight.

The component (C) is preferably an LDS additive with an absorptioncoefficient, different from zero, for UV, VIS or IR radiation, whichforms metal nuclei under the action of electromagnetic radiation,preferably in the form of laser radiation, said metal nucleifacilitating and/or enabling and/or improving the deposition, in achemical metallisation process, of metal layers in order to generateconductor tracks at the irradiated points over the surface of themoulded part, wherein the LDS additive preferably has an absorptioncapability in the visible and infrared radiation range with anabsorption coefficient of at least 0.05, preferably at least 0.1, and inparticular at least 0.2, and/or wherein an absorber is provided, whichtransfers the radiation energy to the LDS additive.

The component (C) is preferably an LDS additive with a mean particlesize (D50) in the range from 50-10,000 nanometers, preferably 200 to5,000 nanometers and particularly preferably 300 to 4,000 nanometers,and/or an aspect ratio of at most 10, in particular of at most 5. TheD50 value specified as a measure for the particle size is a measure forthe mean particle size, wherein 50 volume % of the sample are finer thanthe D50 value and the other 50% of the sample are coarser than the D50value (median).

The component (C) is preferably an LDS (laser direct structuring)additive selected from the group of metal oxides, in particular what areknown as spinels having the general chemical formulaAB₂O₄wherein A stands for a metal cation with the valency 2, wherein A ispreferably selected from the group consisting of: magnesium, copper,cobalt, zinc, tin, iron, manganese and nickel, and combinations thereof;

B stands for a metal cation of valency 3, wherein B is preferablyselected from the group consisting of: manganese, nickel, copper,cobalt, tin, titanium, iron, aluminium and chromium, and combinationsthereof,

wherein the LDS additive particularly preferably is a copper ironspinel, a cupriferous magnesium aluminium oxide, a copper chromiummanganese mixed oxide, a copper manganese iron mixed oxide, optionallyin each case with oxygen defects, or salts and oxides of copper, inparticular such as copper(I) oxide and, copper(II) oxide, alkalinecopper phosphates, copper sulphate, and also metal complex compounds, inparticular chelate compounds of copper, tin, nickel, cobalt, silver andpalladium, or mixtures of such systems,

and/or in particular is selected from the following group: copperchromium manganese mixed oxides, copper manganese iron mixed oxides,copper chromium oxide, zinc iron oxide, cobalt chromium oxide, cobaltaluminium oxide, magnesium aluminium oxide, and mixtures thereof and/orsurface-treated forms thereof and/or forms thereof having oxygendefects. For example, such systems are described for example inWO-A-2000/35259 or in Kunststoffe 92 (2002) 11, 2-7.

The proportion of component (D) preferably lies in the range of 0-20% byweight, preferably in the range of 0-15% by weight, and particularlypreferably in the range of 2-15% by weight or 3-10% by weight. Forexample, talc can facilitate the generation of metal nuclei.

The moulding composition may preferably be characterised in that thepolyamide moulding composition is substantially, preferably completely,free from particulate filler of component (D).

All fillers known to a person skilled in the art can be considered asparticulate fillers of component (D). These include, in particular,particulate fillers selected from the group consisting of: talc(magnesium silicate), mica, silicates, quartz, wollastonite, kaolin,silicic acids, magnesium carbonate, magnesium hydroxide, chalk, groundor precipitated calcium carbonate, lime, feldspar, inorganic pigments,such as barium sulphate, zinc oxide, zinc sulphide, titanium dioxide,iron oxide, iron manganese oxide, permanently magnetic or magnetisablemetals or alloys, hollow-spherical silicate fillers, aluminium oxide,boron nitride, boron carbide, aluminium nitride, calcium fluoride, andmixtures thereof. The fillers may also be surface-treated.

These fillers (component D) have a mean particle size (D50) in the rangeof 0.1-40 μm, preferably in the range of 0.2-20 μm, in particular in therange of 0.3-10 μm. A form of the particulate fillers, in which theaspect ratios L/b1 and L/b2 are both at most 10, in particular at most5, is preferred, wherein the aspect ratios are described by thequotients from the greatest length L of the particle to the averagebreadth b1 or b2 thereof. Here, b1 and b2, which are arrangedperpendicularly with respect to one another, lie in a planeperpendicular with respect to the length L.

Of course, the thermoplastic polyamide moulding composition according tothe invention may also contain conventional additives generally known toa person skilled in the art in the form of the additives (E), which arepreferably selected from the group consisting of: adhesion promoters,halogen-containing flame retardants, halogen-free flame retardants,stabilisers, anti-ageing agents, antioxidants, antiozonants, lightstabilisers, UV stabilisers, UV absorbers, UV blockers, inorganic heatstabilisers, in particular based on copper halides and alkali halides,organic heat stabilisers, conductive additives, carbon black, opticalbrighteners, processing aids, nucleation agents, crystallisationaccelerators, crystallisation retarders, flow aids, lubricants, releaseagents, plasticisers, (organic) pigments, dyes, markers, and mixturesthereof.

The invention further relates to a component, in particular a componenthaving electrical conductor tracks, based on a moulding composition asillustrated above. Fields of use for MID technology include automotiveengineering, industrial automation, medical engineering, the domesticappliance industry, consumer electronics, telecommunications technology,metrology and analysis technology, mechanical engineering, and alsoaviation and aerospace. The invention therefore also relates to anarticle, in particular an interconnected device, containing a mouldedpart, produced from the moulding composition according to the invention.In one embodiment, the interconnected device is used in order to form anantenna.

Such moulded parts include, for example, casings or casing parts forportable electronic devices, such as PDAs, mobile telephones, and othertelecommunications devices, casings or casing parts for personalcomputers, notebooks, medical devices, such as hearing aids, sensortechnology, or RFID (radio frequency identification) transponders, orparts for the automotive industry, such as air bag modules andmulti-functional steering wheels.

Due to the comprehensive shaping options with injection moulding ofplastics, three-dimensional interconnected devices can be produced. Inaddition, typical mechanical functions, such as holders, guides,sensors, plugs or other connection elements, can be integrated.Connectors for E/E and for fuel systems are also possible. Furtherembodiments are specified in the dependent claims.

DESCRIPTION OF PREFERRED EMBODIMENTS

The invention will be described hereinafter with use of specificexemplary embodiments (B) and compared with the less efficient systemsaccording to the prior art (VB). The exemplary embodiments specifiedbelow are intended to support the invention and to demonstrate thedifferences from the prior art, but are not intended to limit thegeneral subject matter of the invention, as is defined in the claims.

Examples B1 to B6 and Comparative Examples VB1 to VB6

The components specified in Tables 1 to 4 were compounded in atwin-screw extruder by Werner and Pfleiderer having a screw diameter of25 mm under predefined process parameters (see Table 1), wherein thepolyamide granulate and the additives were metered into the feed zone,whereas the glass fibre was metered into the polymer melt via a sidefeeder, 3 housing units before the die. The composition summarised inTables 2, 3 and 4 were removed in the form of a strand from a die havinga 3 mm diameter and were granulated after water cooling. The granulatewas dried for 24 hours at 110° C. under vacuum of 30 mbar. With regardto the moulding composition of examples B6 and VB6, the granulation wascarried out by means of underwater granulation or die-face pelletisationunder water, in which the polymer melt is pressed through a hole-typedie and is granulated directly after the exit from the die by a rotatingblade in a water flow. After granulation and drying at 120° C. for 24 h,the granulate properties were measured and the test specimen wasproduced.

TABLE 1 Compounding and injection moulding conditions for the examplesand comparative examples B1, B2, B3, B4, Compounding/processingparameter VB1, VB2 VB3, VB4 B5, VB5 B6, VB6 compounding cylindertemperatures 260 270 250 330 screw rotational speed 200 200 150 150throughput 10 10 8 8 injection cylinder temperatures 260 260 240 330moulding mould temperature 40 40 80 120 screw perimeter speed 15 15 1515Processing:

The compositions were injection moulded using an Arburg Allrounder320-210-750 injection moulding machine at defined cylinder temperaturesin zones 1 to 4 and at a defined mould temperature (see Table 1) to formtest specimens.

TABLE 2 Composition and properties of examples B1 and B2 and also ofcomparative examples VB1, VB2-1 to VB2-3 Unit B1 B2 VB1 VB2-1 VB2-2VB2-3 Composition PA1010 % by 36.6 36.6 36.6 36.6 36.6 36.6 weight PA6I/6T (70:30) % by 9.1 9.1 9.1 9.1 9.1 9.1 weight glass fibre E10 % by50.0 54.0 weight glass fibre S10 % by 50.0 54.0 weight glass fibre E7 x28 % by 50 54 weight copper chromite % by 4.0 4.0 4.0 0 0 0 (Cu₂CrO₄)weight Irganox 1098 % by 0.3 0.3 0.3 0.3 0.3 0.3 weight Propertiestensile modulus of MPa 15300 12900 11500 17300 15500 14300 elasticitytear strength MPa 167 139 135 205 207 203 elongation at tear % 2.5 2.02.1 3.4 2.9 3.5 impact toughness kJ/m² 59 50 44 74 93 78 23° C. notchtoughness kJ/m² 11 9 8 14 20 14 23° C. metallisation index — 0.65 0.700.68 n.d n.d n.d adhesive strength [N/mm] 1.35 1.48 1.16 n.d n.d n.dadhesive strength — 0. 0 1 n.d n.d n.d after storage

TABLE 3 Composition and properties of examples B3 and B4 and also ofcomparative examples VB3, VB4-1 to VB4-3 Unit B3 B4 VB3 VB4-1 VB4-2VB4-3 Composition PA 12 % by 45.7 45.7 45.7 49.7 49.7 49.7 weight glassfibre E10 % by 50.0 50.0 weight glass fibre S10 % by 50.0 50.0 weightglass fibre E7x28 % by 50 50 weight copper chromite (Cu₂CrO₄) % by 4.04.0 4.0 0 0 0 weight Irganox 1098 % by 0.3 0.3 0.3 0.3 0.3 0.3 weightProperties tensile modulus of elasticity MPa 12900 12400 11100 1350013200 12000 tear strength MPa 152 119 115 165 180 160 elongation at tear% 3.3 2.6 2.8 5.5 3.3 5.3 impact toughness 23° C. kJ/m² 65 55 48 78 9873 notch toughness 23° C. kJ/m² 18 16 12 24 29 23 metallisation index- —0.46 0.52 0.49 n.d n.d n.d adhesive strength [N/mm] 0.94 1.01 1.06 n.dn.d n.d adhesive strength after — 0 0 0 n.d n.d n.d storage

TABLE 4 Composition and properties of examples B5 and B6 and also ofcomparative examples VB5 and VB6 B5 VB5 B6 VB6 Composition PA1010 % by44.6 44.6 weight PA 6I/6T (70:30) % by 11.1 11.1 weight PA6T/6I/10T/10I% by 67.7 67.7 weight glass fibre E10 % by 30.0 30 weight glass fibreS10 % by weight glass fibre E7×28 % by 30.0 30 weight copper chromite(Cu₂CrO₄) % by 4.0 4.0 3.0 3.0 weight Irganox 1098 % by 0.3 0.3 0.3 0.3weight Microtalc IT extra % by 10.0 10.0 weight Properties tensilemodulus of elasticity MPa 11200 10100 11300 10900 tear strength MPa 120110 155 143 elongation at tear % 2.1 2.1 2.2 1.8 impact toughness 23° C.kJ/m² 48 32 59 35 notch toughness 23° C. kJ/m² 10 7 16 9 metallisationindex- — 0.85 0.78. 0.72 0.65 adhesive strength [N/mm] 1.55 1.40 0.940.88 adhesive strength after storage — 0 0 0 1 n.m.: non-metallisable;n.d.: not determined Key: PA 6I/6T (70:30) amorphous, semi-aromaticpolyamide based on terephthalic acid, isophthalic acid and1,6-hexanediamine, with a glass transition temperature of 125° C. and asolution viscosity of 1.54. PA 1010 semi-crystalline, aliphaticpolyamide based on 1,10-decandiamine and sebacic acid, with a meltingpoint of 200° C. and a solution viscosity of 1.78. PA 12semi-crystalline, aliphatic polyamide based on laurolactam, with amelting point of 178° C. and a solution viscosity of 1.96. PA MACM12amorphous polyamide based on bis-(4-amino-3-methyl-cyclohexyl)-methaneand dodecane diacid, with a glass transition temperature of 156° C. anda solution viscosity of 1.82. PA 6T/6I/10T/10I semi-crystalline,semi-aromatic polyamide, produced from 29.66% by weight ofhexanediamine, 15.35% by weight of decanediamine, 47.25% by weight ofterephthalic acid and 7.48% by weight of isophthalic acid with a meltingpoint of 318° C. and a solution viscosity of 1.62. glass fibre E10 cutglass fibres Vetrotex 995 consisting of E-glass, with a length of 4.5 mmand a diameter of 10 μm (circular cross section) by Owens CorningFibreglass glass fibre F7 x 28 cut glass fibres CSG3PA-820 consisting ofE-glass, with a length of 3 mm, a main cross-sectional axis of 28 μm, asecondary cross-sectional axis of 7 μm and an axis ratio of 4(non-circular cross section) by NITTO BOSEKI, Japan glass fibre S10 cutglass fibres Vetrotex 995 consisting of E-glass, with a length of 4.5 mmand a diameter of 10 μm (circular cross section) by Owens CorningFibreglass copper chromite Shepherd Black 30C965 (The Shepherd ColorCompany), copper chromite (CuCr2O4) with a mean particle size of 0.6 μm.

Contrary to expectations, comparative tests VB2-1 to VB2-3 demonstratethat there are no advantages in terms of tear strength and elongation attear for the reinforcement by means of S-glass fibres or flat E-glassfibres compared to round E-glass fibres. The values for tear strength,elongation at tear and impact toughness achieved for the mouldingcompositions argue against the selection of the S-glass fibres. Theround E-glass fibre is practically equivalent apart from the tensilemodulus of elasticity, and the flat E-glass fibres are considerablysuperior with respect to tear strength and impact toughness.

If an LDS additive, such as copper chromite (black spinel), is thenadded to these moulding compositions in a concentration of 4%, themechanical properties of all moulding compositions considered thusworsen, sometimes drastically. However, mechanical properties of themoulding compositions (B1 and B2) reinforced with the S-glass fibre andwith flat E-glass fibres decrease less severely than the mouldingcomposition based on conventional E-glass (VB1).

The moulding compositions based on polyamide PA12 and summarised inTable 2 behave similarly. In this case too, the filler-free mouldingcomposition reinforced with S-glass (VB4-1) also demonstrates hardly anyadvantages in respect of the mechanical properties compared to thecost-effective E-glass fibre (VB4-3), and even demonstrate disadvantagescompared to the flat E-glass fibre (VB4-2). The flat E-glass fibredemonstrates advantages with regard to impact toughness. Only with theaddition of copper chromite are the advantages of the S-glass fibre andthe flat E-glass fibre evident, specifically considerably improved tearstrength and greater elongation at tear and impact toughness.

Even with a predominantly amorphous matrix, as in examples B5 and VB5,approximately the same conditions as described above are produced. Forthe moulding composition according to the invention, there is a muchgreater tear strength and improved impact toughness with considerablygreater rigidity.

The measurements were taken in accordance with the following standardand on the following test specimens.

Tensile Modulus of Elasticity:

-   -   ISO 527 with a strain rate of 1 mm/min    -   ISO tension bar, standard: ISO/CD 3167, Al type, 170×20/10×4 mm,        temperature 23° C.        Tear Strength, Elongation at Tear:    -   ISO 527 with a strain rate of 5 mm/min    -   ISO tension bar, standard: ISO/CD 3167, Al type, 170×20/10×4 mm,        temperature 23° C.        Impact Toughness, Notch Toughness by Charpy:    -   ISO 179    -   ISO test bar, standard: ISO/CD 3167, B1 type, 80×10×4 mm at        temperature 23° C.        Melting Point (Tm), Enthalpy of Fusion (ΔHm) and Glass        Transition Temperature (Tg):    -   ISO standard 11357-11-2    -   granulate    -   Differential scanning calorimetry (DSC) was carried out with a        heating rate of 20° C./min. The temperature for the onset is        specified for the glass transition temperature (Tg).        Relative Viscosity:    -   DIN EN ISO 307, in 0.5% by weight of m-cresol solution,        temperature 20° C. granulate        Laser Structuring:

In order to assess the metallisation behaviour, injection-moulded parts(plate 60×60×2 mm) were structured with the aid of an Nd:YAG laser andwere then metallised currentlessly in a copper-plating bath. During thelaser structuring process, 18 adjacent areas measuring 5×7 mm in sizewere irradiated over the surface of the moulded part. The laserstructuring process was carried out by means of an LPKF Microline 3Dlaser at a wavelength of 1064 mm and an irradiation breadth ofapproximately 50 μm at a rate of 4 m/s. Here, both the pulse frequencyand the power of the laser were varied. For the specific pulsefrequencies of 60, 80 and 100 kHz, the power was varied in each case inthe range of 3-17 watt. The moulded parts were then subjected, after thelaser structuring process, to a cleaning process in order to remove theresidues of the laser process. Here, the moulded parts pass throughsuccessive ultrasonic baths with surfactant and deionised water. Thecleaned moulded parts are then metallised in a reductive copper-platingbath (MacDermid MID-Copper 100 B1) for 60-80 minutes. In so doing,copper is deposited on the areas irradiated by the laser in an averagethickness of 3 to 5 μm.

Metallisation Index:

The degree of metallisation was determined in comparison to a referencematerial (PBT Pocan 7102). Here, the quotient (=metallisation index)from the copper layer thickness on the material in question and that onthe reference material is established. The layer thickness of theconductor track is determined by means of X-ray fluorescencespectroscopy.

Adhesive Strength:

The adhesion of the copper conductive tracts produced is measured in apeel test in accordance with DIN IEC 326-3-7.1.

Adhesive Strength after Storage:

The adhesion of the copper layer after various storage conditions isobtained by means of the cross-cut test in accordance with EN DIN ISO2409. For this purpose, 6 cuts continuing to the substrate are made atright angles using a multiple cutting blade with a cut spacing of 1 mm,such that a lattice pattern is produced. An adhesive strip havingdefined adhesive force is then pressed onto the cross-cut so that loosecopper layer areas or copper layer areas adhering poorly to thesubstrate are removed. The visual assessment is carried out with the aidof an illuminated magnifier. The degree of adhesion is classified inaccordance with the characteristic values 0-5, defined as follows:

-   0: the edges of the cuts are completely smooth; none of the squares    of the lattice is chipped.-   1: small splinters of the coating are chipped at the points of    intersection of the lattice lines; chipped area is no greater than    5% of the cross-cut area.-   2: the coating is chipped along the edges of the cut and/or at the    points of intersection of the lattice lines. Chipped area is greater    than 5%, but no greater than 15% of the cross-cut area.-   3: the coating is chipped along the edges of the cuts in wide    strips, either partially or completely, and/or some squares are    chipped partially or completely. Chipped area is greater than 30%,    but no greater than 50% of the cross-cut area.-   4: the coating is chipped along the edges of the cuts in wide    strips, and/or some squares are chipped completely or partially.    Chipped area is greater than 35%, but no greater than 65% of the    cross-cut area.-   5: any chipping that can no longer be classified as grid cut    characteristic value 4.    Storage Conditions:

The adhesion of the conductor track was measured with the aid of theabove-described grid cut test after two different storage phases underthe following conditions:

-   -   Profile 1: dry, temperature change from −40° C. to 85° C., 6        cycles, each lasting 8 h.    -   Profile 2: 95% relative humidity, temperature change from 25° C.        to 55° C., 6 cycles, each lasting 24 h.

With all MID techniques, the chemically-reductive copper deposition isthe decisive start metallisation process, which is key to the quality ofthe overall layer. It is therefore quite sufficient to assess thequality of the primary metal layer. In order to produce the finished MIDpart, nickel and then an end layer consisting of immersion gold aregenerally then deposited on the first copper layer (primary layer). Ofcourse, other metal layers, such as further copper, palladium, tin orsilver layers, can also be applied to the primary layer.

The invention claimed is:
 1. A thermoplastic moulding compositionconsisting of: (A) 20-88% by weight of a thermoplastic material; (B)10-60% by weight of fibrous fillers, formed from (B1) 10-60% by weightof glass fibres (B1-1) with a non-circular cross section, wherein theaxis ratio of the main cross-sectional axis to the secondarycross-sectional axis is at least 2; (B2) 0-20% by weight of glassfibres, which are different from the glass fibres of component (B1) andhave a circular cross section; (B3) 0-20% by weight of further fibrousfillers, which are different from the fibres of components (B1) and(B2), are not based on glass, and are selected from the group: carbonfibres, graphite fibres, aramid fibres, nanotubes; (C) 2-10% by weightof laser direct structuring additive or a mixture of laser directstructuring-additives; (D) 0-30% by weight of particulate filler; and(E) 0-2% by weight of further, different additives; wherein the sum of(A)-(E) makes up 100% by weight.
 2. The moulding composition accordingto claim 1, wherein the component (A) consists of polyamide (A1) or amixture of polyamides, with the proviso that up to 40%, thereof can bereplaced by a thermoplastic material (A2) not based on polyamide.
 3. Themoulding composition according to claim 2, wherein the proportion ofcomponent (A) lies in the range of 25-82% by weight.
 4. The mouldingcomposition according to claim 1, wherein the proportion of component(B1) lies the range of 30-65% by weight.
 5. The moulding composition asclaimed in claim 1, characterised in that wherein the glass fibres ofcomponent (B1-1) are selected as E-glass fibres in accordance with ASTMD578-00 with a non-circular cross section.
 6. The moulding compositionaccording to claim 1, characterised in that the proportion of component(C) lies in the range of 3-8% by weight.
 7. The moulding compositionaccording to claim 1, wherein the component (C) is an laser directstructuring additive with an absorption coefficient, different fromzero, for ultraviolet, visible or infrared radiation, which forms metalnuclei under the action of electromagnetic radiation and facilitatesand/or enables and/or improves the chemical metallising deposition ofconductor tracks at the irradiated points.
 8. The moulding compositionaccording to claim 7, wherein the component (C) is an laser directstructuring additive with an average particle size (D50) in the range of50-10,000 nanometers.
 9. The moulding composition according to claim 1,wherein the component (C) is an laser direct structuring additiveselected from the group of metal oxides are known as spinels having thegeneral chemical formula AB2O4 wherein A stands for a metal cation withthe valency 2, B stands for a metal cation of valency
 3. 10. Themoulding composition according to claim 1, characterised in that whereinthe proportion of component (D) lies in the range of 0-20% by weight.11. The moulding composition according to claim 1, wherein theparticulate filler has particles of a mean particle size (D50) in therange of 0.1-40 [mu]m, and/or has an aspect ratio of at most
 10. 12. Themoulding composition according to claim 1, wherein the component (A) isselected from the group consisting of: polyamide, polycarbonate,polystyrene, polymethyl methacrylate, acrylonitrile butadiene styrenecopolymer, acrylonitrile styrene copolymer, polyolefin,polyoxymethylene, polyester, polysulfone, polyphenylene ether,polyphenylene sulphide, polyphenylene oxide, liquid-crystallinepolymers, polyether ketone, polyether ether ketone, polyimide, polyamideimide, polyester imide, polyether amide, polyester amide, polyetherester amide, polyurethane, polysiloxane, polyacrylate, polymethacrylate,and mixtures or copolymers based on such systems and/or in that theproportion of component (A2) lies in the range of 0-20% by weight and/orin that the proportion of component (B2), lies in the range of 0-10% byweight.
 13. The moulding composition according to claim 1, wherein theglass fibres of component (B1) and/or (B2) and/or (B3) are present inthe form of short fibers with a length approximating 0.2-20 mm, or inthe form of endless fibres.
 14. A component, in particular a componenthaving electrical conductor tracks, based on a moulding compositionaccording to claim
 1. 15. The moulding composition according to claim 1,wherein the component (A) consists of polyamide (A1) or a mixture ofpolyamides, with the proviso that up to 5% thereof can be replaced by athermoplastic material (A2) not based on polyamide.
 16. The mouldingcomposition according to claim 1, wherein the component (A) consists ofpolyamide (A1) or a mixture of polyamides.
 17. The moulding compositionaccording to claim 2, wherein total proportion of (A) in the form ofpolyamide (A1) is in the range of 25-82% by weight.
 18. The mouldingcomposition according to claim 2, wherein total proportion of (A) in theform of polyamide (A1) is in the range of 30-77% by weight.
 19. Themoulding composition according to claim 1, wherein the proportion ofcomponent (B1) lies in the range of 35-60% by weight.
 20. The mouldingcomposition according to claim 1, wherein the proportion of component(B1) lies the range of 30-65% by weight and wherein the proportions of(B2) and/or (B3) are further preferably zero.
 21. The mouldingcomposition as claimed in claim 1, wherein the glass fibres of component(B1-1) are selected as E-glass fibres in accordance with ASTM D578-00with a non-circular cross section, consisting of 52-62% of silicondioxide, 12-16% of aluminium oxide, 16-25% of calcium oxide, 0-10% ofborax, 0-5% of magnesium oxide, 0-2% of alkali oxides, 0-1.5% oftitanium dioxide and 0-0.3% of iron oxide.
 22. The moulding compositionaccording to claim 1, wherein the proportion of component (C) lies inthe range of 3-6% by weight.
 23. The moulding composition according toclaim 1, wherein the component (C) is an laser direct structuringadditive with an absorption coefficient, different from zero, forultraviolet, visible or infrared radiation, which forms metal nucleiunder the action of electromagnetic radiation, in the form of laserradiation, and facilitates and/or enables and/or improves the chemicalmetallising deposition of conductor tracks at the irradiated points,wherein the laser direct structuring additive has an absorptioncapability in the visible and infrared radiation range with anabsorption coefficient of at least 0.2, and/or wherein an absorber isprovided, which transfers the radiation energy to the laser directstructuring additive.
 24. The moulding composition according to claim 7,wherein the component (C) is an laser direct structuring additive withan average particle size (D50) in the range of 300 to 4,000 nanometers,and/or has an aspect ratio of at most
 5. 25. The moulding compositionaccording to claim 1, wherein the component (C) is an laser directstructuring additive selected from the group of metal oxides, what areknown as spinels having the general chemical formulaAB₂O₄ wherein A stands for a metal cation with the valency 2, wherein Ais selected from the group consisting of: magnesium, copper, cobalt,zinc, iron, manganese, tin and nickel, and also combinations thereof; Bstands for a metal cation of valency 3, wherein B is selected from thegroup consisting of: manganese, nickel, copper, cobalt, tin, titanium,iron, aluminium and chromium, and also combinations thereof.
 26. Themoulding composition according to claim 1, wherein the component (C) isan laser direct structuring additive is a copper iron spinel, acupriferous magnesium aluminium oxide, a copper chromium manganese mixedoxide, a copper manganese iron mixed oxide, optionally in each case withoxygen defects, or copper salts and oxides, namely copper(I) oxide,copper(II) oxide, alkaline copper phosphates, copper sulphate, and alsometal complex compounds, or chelate compounds of copper, tin, nickel,cobalt, silver and palladium, or mixtures of such systems, and/or isselected from the following group: copper chromium manganese mixedoxides, copper manganese iron mixed oxides, copper chromium oxide, zinciron oxide, cobalt chromium oxide, cobalt aluminium oxide, magnesiumaluminium oxide, and mixtures and/or surface-treated forms thereofand/or forms thereof having oxygen defects.
 27. The moulding compositionaccording to claim 1, wherein the proportion of component (D) lies inthe range of 3-10% by weight.
 28. The moulding composition according toclaim 1, wherein the particulate filler has particles of a mean particlesize (D50) in the range of 0.3-10 μm, and/or has an aspect ratio of atmost 5, or is formed substantially by such particles.
 29. The mouldingcomposition according to claim 1, wherein the proportion of component(A2) is in the range 0-5% by weight, or wherein component (A1) isprovided exclusively; and/or in that the proportion of component (B2),selected from the group consisting E-glass fibres, A-glass fibres,C-glass fibres, D-glass fibres, basalt fibres and mixtures thereof, liesin the range of 0-5% by weight, or wherein component (B1) is providedexclusively.
 30. The moulding composition according to claim 1, whereinthe glass fibres of component (B1) and/or (B2) are present in the formof short fibres, in the form of cut glass with a length in the range of0.2-20 mm.
 31. A component having electrical conductor tracks, based ona moulding composition according to claim
 1. 32. A component havingelectrical conductor tracks, based on a moulding composition accordingto claim 1, as a casing or casing part for portable electronic devices,as personal digital assistants, mobile telephones, telecommunicationsdevices, casings or casing parts for personal computers, notebooks,medical devices, i hearing aids, sensor technology, or radio frequencyidentification transponders or parts for the automotive field, as airbag modules and multi-function steering wheels.